CDMA/EVDO PCS-band wireless handsets and data devices
The AWT6301R meets the increasing demands for higher efficiency and linearity in CDMA1X handsets. The package pinout was chosen to enable handset manufacturers to switch from a 4mm x 4mm PA module with very few layout changes to the phone board. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-theart reliability, temperature stability, and ruggedness. Selectable bias modes that optimize efficiency for different output power levels, and a shutdown mode with low leakage current, serve to increase handset talk and standby time. The self contained 3 mm x 3 mm x 1 mm surface mount package incorporates matching networks optimized for output power, efficiency and linearity in a 50 Ω system.
• InGaP HBT Technology
• High Efficiency:
40%, VMODE = 0 V
41%, VMODE = +2.85 V (no mode switching)
• Low Quiescent Current: 50 mA
• Low Leakage Current in Shutdown Mode: <1 μA
• VREF = +2.85 V (+2.75 V Min Over Temp.)
• Optimized for a 50 Ω System
• Low Profile Surface Mount Package: 1.1mm
• CDMA 1XRTT, 1xEV-DO Compliant
• Pinout Enables Easy Phone Board Migration From 4 mm x 4 mm Package
• RoHS Compliant Package, 250 oC MSL-3
|
Frequency (MHz) |
824 - 849 |
|
Peak CDMA Output Power (dBm) |
28 |
|
Power Added Efficiency (%) |
41% @ +28 dBm |
|
Icq (mA) |
50 |
| Package (mm) | 3 x 3 x 1.1 |
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