HELP3™ Dual-band 900 MHz/IMT UMTS 3.4 V HSDPA Linear Power Amplifier Module
The AWT6224 addresses the demand for increased integration in dual-band handsets for EGSM network deployments. The small footprint 3 mm x 5 mm x 1 mm surface mount RoHS compliant package contains independent RF PA paths to ensure optimal performance in both frequency bands, while achieving a 25% PCB space savings compared with solutions requiring two single-band PAs. The package pinout was chosen to enable handset manufacturers to easily route VCC to both power amplifiers and simplify control with a common Vmode pin. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness.
The AWT6224 incorporates ANADIGICS’ HELP3™ technology to provide low power consumption without the need for an external voltage regulator. Two operating modes provide optimum efficiency at high and medium/low power output levels, thereby dramatically increasing handset talk-time and standby-time. Its built-in voltage regulator eliminates the need for external voltage regulation and load switches. The 3 mm x 5 mm x 1mm surface mount package incorporates matching networks optimized for output power, efficiency and linearity in a 50 Ω system.
• InGaP HBT Technology
• High Efficiency:
20 % @ +16 dBm Pout (without DC/DC Converter)
40 % @ maximum Pout
• Low Quiescent Current: 8 mA
• Internal Voltage Regulation
• Common Vmode Control Line
• Simplified Vcc Bus PCB routing
• Reduced External Component Count
• Low Profile Surface Mount Package: 1 mm
• HSDPA Compliant
• RoHS Compliant Package, 250 ºC MSL-3
| Frequency (MHz) | 880-915; 1920-1980 |
| Package Size (mm) | 3 x 5 x 1 |
| PAE (%) | 20 % @ +16 dBm; 40 % @ maximum |
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| » AWT6224 | | | HELP3™ Dual-band 900 MHz/IMT UMTS 3.4 V HSDPA Linear Power Amplifier Module |
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