The AWB7224 is a fully matched, Multi-Chip-Module (MCM) designed for picocell, femtocell, and customer premises equipment (CPE) applications. Consisting of two parallel path high linearity, high efficiency power amplifiers, the device meets the extremely demanding needs of small cell infrastructure architectures. Designed for LTE, WCDMA and HSDPA air interfaces operating in the 728 MHz to 768 MHz bands, the AWB7224 delivers up to +27 dBm of LTE (E-TM1.1) power through an external 90-degree hybrid coupler, with an ACPR of -47 dBc. The device operates from a convenient +4.5 V supply and provides 29 dB of RF gain. The AWB7224 is manufactured using an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness. Its 7 mm x 7 mm x 1.3 mm surface mount package incorporates RF matching networks optimized for output power, efficiency, and linearity in a 50 Ω system.