The AWB7225 is a fully matched Multi-Chip-Module (MCM) designed for picocell, femtocell, and customer premises equipment (CPE) applications. Consisting of two parallel path high linearity, high efficiency power amplifiers, the device meets the extremely demanding needs of small cell infrastructure acrhicectures. Designed for LTE, WCDMA, HSDPA air interfaces operating in the 860 MHz to 894 MHz bands, the AWB7225 delivers up to +27 dBm of LTE (E-TM1.1) power with an ACPR of -47 dBc. The device operates from a convenient +4.5 V supply and provides 29.5 dB of gain. The device is manufactured using an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness. Its 7 mm x 7 mm x 1.3 mm surface mount package incorporates RF matching networks optimized for output power, efficiency, and linearity in a 50 Ω system.