The AWB7227 is a fully matched, Multi-Chip-Module (MCM) designed for picocell, femtocell, and customer premises equipment (CPE) applications. Its high linearity and efficiency meet the extremely demanding needs of small cell infrastructure architectures. Designed for WCDMA, HSDPA, and LTE air interfaces operating in the 2.11 GHz to 2.17 GHz band, the AWB7227 delivers up to +27 dBm of WCDMA (64 DPCH) power with an ACPR better than -50 dBc. It operates from a convenient +4.5 V supply and provides 30 dB of gain. The device is manufactured using an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness. The self-contained 7 mm x 7 mm x 1.3 mm surface mount package incorporates RF matching networks optimized for output power, efficiency, and linearity in a 50 Ω system.